- Industry: Semiconductors
- Number of terms: 2987
- Number of blossaries: 0
- Company Profile:
National Semiconductor Corporation designs, develops, manufactures, and markets analog and mixed-signal integrated circuits and sub-systems.
A thin film of dielectric oxide material bridging the source and drain regions of an MOS semiconductor.
Industry:Semiconductors
Qualification or quality conformance data on devices from the same generic product family as the device shipped.
Industry:Semiconductors
A group of devices manufactured and assembled on the same line(s), using the same processes and materials, and designed to perform the same basic function (e.g., operational amplifiers, TTL gates, etc.).
Industry:Semiconductors
Sealing accomplished through the melting and re-hardening of a glass seal ring (or frit) between the package base and lid. The package leads typically pass through the sealing area.
Industry:Semiconductors
The protective coating (usually silicon dioxide or silicon nitride) placed on the entire dire surface (exclusive of bonding pads).
Industry:Semiconductors
A PN junction made by controlling the type of impurity in a single crystal while it is being grown from a melt.
Industry:Semiconductors
The physical elements and interfaces that constitute a component or system.
Industry:Semiconductors
A software tool used for hardware design (see CAD).
Industry:Semiconductors
Sometimes called metal can package-A cylindrical semiconductor package with a metal lid and with leads emanating from the package base. A header may or may not have a ceramic standoff to prevent contact with the mounting surface.
Industry:Semiconductors
Leak or seal testing performed on all hermetic packages to confirm seal integrity. This is done in two steps, fine leak, which looks at leak rates in the 5 x 10-8 cc/sec range, and gross leak, which looks for devices with gross seal defects.
Industry:Semiconductors
