- Industry: Semiconductors
- Number of terms: 2987
- Number of blossaries: 0
- Company Profile:
National Semiconductor Corporation designs, develops, manufactures, and markets analog and mixed-signal integrated circuits and sub-systems.
A semiconductor or semiconductor die containing multiple elements (which may be located on the die or on a hybrid substrate) which act together to form the completed device circuit.
Industry:Semiconductors
The metallization connecting two or more active elements on the surface of a die; also, the wires connecting the die to the package leads.
Industry:Semiconductors
Visual inspection of the device prior to seal to insure that die, wires and package conform to all applicable specifications.
Industry:Semiconductors
The amount of residual moisture trapped within a semiconductor package cavity after device sealing, usually stated in ppm at 100°C.
Industry:Semiconductors
Introduction into a semiconductor of selected impurities in controlled regions (via high voltage ion bombardment) to achieve desired electronic properties.
Industry:Semiconductors
An area of the die surrounded by an isolation diffusion (normally P+) to prevent electrical leakage between adjacent circuit elements.
Industry:Semiconductors
The trademarked designator used to indicate that a given device was manufactured and screened in accordance with a controlled government specification. The JAN mark is frequently abbreviated to J when used on smaller devices.
Industry:Semiconductors
The boundary between a P-region and an N-region in a silicon substrate.
Industry:Semiconductors
That portion of the resistor area of a microcircuit from which resistor material has been removed or modified by trimming.
Industry:Semiconductors
Similar to an LTPD, except that it is expressed in percent per thousand hours.
Industry:Semiconductors
